06515370 is referenced by 25 patents and cites 9 patents.

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (

10

) having a semiconductor chip (

12

) with electrodes (

16

), a stress-relieving layer (

14

) prepared on the semiconductor chip (

12

), a wire (

18

) formed across the electrodes (

16

) and the stress-relieving layer (

14

), and solder balls (

19

) formed on the wire (

18

) over the stress-relieving layer (

14

); and a bare chip (

20

) as a second semiconductor device to be electrically connected to the first semiconductor device (

10

).

Title
Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
Application Number
9/180225
Publication Number
6515370 (B2)
Application Date
April 22, 1999
Publication Date
February 4, 2003
Inventor
Nobuaki Hashimoto
Suwa
US
Agent
Oliff & Berridge
US
Assignee
Seiko Epson Corporation
US
IPC
H01L 23/48
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