06482680 is referenced by 193 patents.

There is disclosed a flip-chip-type method of assembling semiconductor devices. The proposed invention offer one step encapsulation process to promote adhesion of die to the lead finger and prevent the potential of shorts from developing between the adjacent bumps (

13

) or lead fingers. Conventional mold compound (

15

) is used to reduce localized stress causes by coefficient of thermal expansion (CTE) mismatch between the die (

11

) and substrate, or the lead frame (

12

). This is particularly favorable in promoting greater mechanical robustness of the semiconductor devices. With one step encapsulation process proposed by the present invention, manufacturing process is made simpler, faster and relatively cheaper.

Title
Flip-chip on lead frame
Application Number
9/910181
Publication Number
6482680 (B1)
Application Date
July 20, 2001
Publication Date
November 19, 2002
Inventor
Ong King Hoo
Perak
US
Lily Khor
Perak
US
Agent
Weingarten Schurgin Gagnebin & Lebovici
US
Assignee
Carsem Semiconductor SDN BHD
US
IPC
H01L 21/44
View Original Source