06476503 is referenced by 127 patents and cites 3 patents.

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.

Title
Semiconductor device having columnar electrode and method of manufacturing same
Application Number
9/606196
Publication Number
6476503 (B1)
Application Date
June 29, 2000
Publication Date
November 5, 2002
Inventor
Noriaki Shiba
Kawasaki
US
Yoshitaka Aiba
Kawasaki
US
Junichi Kasai
Kawasaki
US
Ryuji Nomoto
Kawasaki
US
Mitsutaka Sato
Kawasaki
US
Tetsuya Fujisawa
Kawasaki
US
Masaaki Seki
Kawasaki
US
Yasunori Fujimoto
Kawasaki
US
Kazuyuki Imamura
Kawasaki
US
Agent
Armstrong Westerman & Hattori
US
Assignee
Fujitsu
US
IPC
H01L 23/48
View Original Source