06420216 is referenced by 213 patents.

An electrical fuse structure comprises a semiconductor substrate; at least one electrically insulating layer over the semiconductor substrate having a portion thereof containing electrical wiring and another, adjacent portion thereof substantially free of electrical wiring; optionally, a further electrically insulating layer over the at least one electrically insulating layer. The electrically insulating layer(s) have a depression formed over the portion substantially free of electrical wiring, with the depression having a lower surface level than an adjacent portion of the electrically insulating layer. The fuse structure also includes a fuse insulator disposed over the depression and a fuse over the fuse insulator. Preferably, the fuse insulator is disposed only in the depression to elevate the fuse to the same level as the adjacent portion of the electrically insulating layer. The fuse structure may have a single layer or comprise alternating layers having different degrees of reflectivity to a laser beam, such as alternating layers of silicon oxide and silicon nitride. The preferred fuse structure comprises an electrically and thermally resistive fuse insulator in the depression, such that the fuse insulator substantially prevents heat of an energy beam directed at the fuse from being transmitted to the semiconductor substrate. More preferably, the fuse formed has a width less that that of the fuse insulator. The fuse structure may further include additional wiring over the electrical insulating layer at the same level as the fuse.

Title
Fuse processing using dielectric planarization pillars
Application Number
9/525729
Publication Number
6420216 (B1)
Application Date
March 14, 2000
Publication Date
July 16, 2002
Inventor
Michael Wise
LaGrangeville
NY, US
Jeremy K Stephens
New Windsor
NY, US
Chandrasekhar Narayan
Hopewell Junction
NY, US
Louis L C Hsu
Fishkill
NY, US
Larry Clevenger
LaGrangeville
NY, US
Agent
Delio & Peterson
US
Agent
H Daniel Schnurmann
US
Peter W Peterson
US
Assignee
Infineon Technologies North America
CA, US
International Business Machines Corporation
NY, US
IPC
H01L 21/82
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