06407929 is referenced by 95 patents.
An electronic package (
) includes one or more capacitors (
) embedded within one or more layers (
) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS.
) or ceramic capacitors. During the package build-up process, the capacitors are mounted (
) to a package layer, and a non-conductive layer is applied (
) over the capacitors. When the build-up process is completed, the capacitor's terminals (
) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (
), an interposer (
), and/or a printed circuit board (