06407929 is referenced by 95 patents.

An electronic package (

302

, FIG.

3

) includes one or more capacitors (

308

) embedded within one or more layers (

310

) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS.

17-18

) or ceramic capacitors. During the package build-up process, the capacitors are mounted (

410

, FIG.

4

) to a package layer, and a non-conductive layer is applied (

412

) over the capacitors. When the build-up process is completed, the capacitor's terminals (

604, 608

, FIG.

6

) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (

1904

, FIG.

19

), an interposer (

1906

), and/or a printed circuit board (

1908

).

Title
Electronic package having embedded capacitors and method of fabrication therefor
Application Number
9/606882
Publication Number
6407929 (B1)
Application Date
June 29, 2000
Publication Date
June 18, 2002
Inventor
Toshimi Kohmura
Ibaraki-ken
US
Joan K Vrtis
Phoenix
AZ, US
David G Figueroa
Mesa
AZ, US
Michael Walk
Mesa
AZ, US
Aaron Dean Hale
Chandler
AZ, US
Agent
Schwegman Lundberg Woessner & Kluth P A
US
Assignee
Intel Corporation
CA, US
IPC
H05K 1/18
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