06399143 is referenced by 38 patents and cites 2 patents.

The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising:

a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; and

b. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.

Title
Method for clamping and electrostatically coating a substrate
Application Number
9/95321
Publication Number
6399143 (B1)
Application Date
June 10, 1998
Publication Date
June 4, 2002
Inventor
Bogdan Brycki
Mt. Laurel
NJ, US
Hoi Cheong Steve Sun
Monmouth Junction
NJ, US
Agent
Dechert
US
Assignee
Delsys Pharmaceutical Corporation
NJ, US
IPC
A61J 3/00
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