06396148 is referenced by 177 patents.

Chips first packaging structures and methods of fabrication are presented which employ electroless metallizations. An electroless barrier metal is disposed over and in electrical contact with at least one aluminum contact pad of the chips first integrated circuit. The electroless barrier metal is a first electroless metal and is a different material than the at least one aluminum contact pad. An electroless interconnect metal is disposed above and electrically contacts the electroless barrier metal. The electroless interconnect metal is a second electroless metal, which is different from the first electroless metal. As an example, the electroless barrier metal comprises electroless nickel and the electroless interconnect metal comprises electroless copper.

Title
Electroless metal connection structures and methods
Application Number
9/501200
Publication Number
6396148 (B1)
Application Date
February 10, 2000
Publication Date
May 28, 2002
Inventor
Michael E Rickley
Reading
MA, US
James E Kohl
Reading
MA, US
Charles W Eichelberger
Wakefield
MA, US
Agent
Heslin Rothenberg Farley & Mesiti P C
US
Agent
Kevin P Radigan Esq
US
Assignee
EPIC Technologies
MA, US
IPC
H01L 23/48
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