06343019 is referenced by 139 patents and cites 2 patents.

An apparatus and method wherein an outer die is mounted on an inner die to form a stack which is mounted on a first surface of a substrate, such as a circuit board, the stack may be mounted filly or partially recessed in a recess which is formed in a first surface of the substrate which is dimensioned for receiving at least a portion of a die therein, and where an aperture may be formed in the recess extending through the substrate to a second side thereof for wire bonding the inner die to the substrate.

Title
Apparatus and method of stacking die on a substrate
Application Number
9/545250
Publication Number
6343019 (B1)
Application Date
April 7, 2000
Publication Date
January 29, 2002
Inventor
Chad A Cobbley
Boise
ID, US
Tongbi Jiang
Boise
ID, US
Agent
Dorsey & Whitney
US
Assignee
Micron Technology
ID, US
IPC
H05K 7/02
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