06335564 is referenced by 159 patents and cites 1 patents.

A semiconductor package and a corresponding method of forming this package are provided. The semiconductor package includes a paddle and a semiconductor device mounted on the paddle. A passive electronic component is also mounted on the paddle and spaced apart from the semiconductor device. Interconnects provide a conductive path from a bonding pad of the semiconductor device to a bonding pad of the passive electronic component such that the passive electronic component and semiconductor device are operatively connected.

Title
Single Paddle having a semiconductor device and a passive electronic component
Application Number
9/83474
Publication Number
6335564 (B1)
Application Date
May 22, 1998
Publication Date
January 1, 2002
Inventor
Siamak Fazel Pour
Irvine
CA, US
Agent
Snell & Wilmer L
US
Assignee
Conexant Systems
CA, US
IPC
H01L 23/495
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