06329605 is referenced by 107 patents and cites 16 patents.

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.

Title
Components with conductive solder mask layers
Application Number
9/277677
Publication Number
6329605 (B1)
Application Date
March 26, 1999
Publication Date
December 11, 2001
Inventor
Belgacem Haba
Cupertino
CA, US
Masud Beroz
Livermore
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
US
Assignee
Tessera
CA, US
IPC
H05K 1/03
View Original Source