06326678 is referenced by 237 patents and cites 16 patents.

A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.

Title
Molded plastic package with heat sink and enhanced electrical performance
Application Number
8/116305
Publication Number
6326678 (B1)
Application Date
September 3, 1993
Publication Date
December 4, 2001
Inventor
John R Fahey
Greenville
SC, US
Edward G Combs
Foster City
CA, US
S C Chang
Riverbank
CA, US
Marcos Karnezos
Menlo Park
CA, US
Agent
Gallagher & Lathrop
US
Agent
Thomas A Gallagher
US
Assignee
Asat
US
IPC
H01L 23/495
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