06326242 is referenced by 89 patents and cites 12 patents.

A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.

Title
Semiconductor package with heat sink and method of fabrication
Application Number
9/430559
Publication Number
6326242 (B1)
Application Date
October 29, 1999
Publication Date
December 4, 2001
Inventor
Walter L Moden
Meridian
ID, US
Mike Brooks
Caldwell
ID, US
Agent
Stephen A Gratton
US
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
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