06324067 is referenced by 106 patents and cites 69 patents.

A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this recess. The components are lower than the surface of the PWB. A conductive pad is provided to the bottom of the recess and a connecting terminal and the conductive pad are electrically connected by using a solder ball or a conductive adhesive material. The recess is formed by partially removing one or more layers of plural conductive layers and insulating layers which make up the multilayer PWB.

Title
Printed wiring board and assembly of the same
Application Number
9/553557
Publication Number
6324067 (B1)
Application Date
April 20, 2000
Publication Date
November 27, 2001
Inventor
Tousaku Nishiyama
Uda-gun
US
Agent
Morrison & Foerster
US
Assignee
Matsushita Electric Industrial
US
IPC
H05K 7/02
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