06316838 is referenced by 389 patents and cites 6 patents.

A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

Title
Semiconductor device
Application Number
9/531231
Publication Number
6316838 (B1)
Application Date
March 20, 2000
Publication Date
November 13, 2001
Inventor
Masahiko Harayama
Kawasaki
US
Akira Okada
Kawasaki
US
Yuji Akashi
Kasugai
US
Mitsutaka Sato
Kawasaki
US
Tetsuya Hiraoka
Kawasaki
US
Hayato Okuda
Aizuwakamatsu
US
Kaname Ozawa
Kawasaki
US
Agent
Armstrong Westerman Hattori McLeland & Naughton
US
Assignee
Fujitsu
US
IPC
H01L 23/48
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