06316825 is referenced by 78 patents and cites 16 patents.

The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame. The entire structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Title
Chip stack package utilizing a connecting hole to improve electrical connection between leadframes
Application Number
9/309399
Publication Number
6316825 (B1)
Application Date
May 10, 1999
Publication Date
November 13, 2001
Inventor
Yoon Hwa Choi
Kyoungki-do
US
Hyung Gil Baik
Kyounki-do
US
Nam Soo Lee
Kyoungki-do
US
Chang Jun Park
Kyoungki-do
US
Myung Geun Park
Seoul
US
Agent
Ladas & Parry
US
Assignee
Hyundai Electronics
US
IPC
H01L 23/02
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