06297548 is referenced by 193 patents and cites 57 patents.

An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

Title
Stackable ceramic FBGA for high thermal applications
Application Number
9/344279
Publication Number
6297548 (B1)
Application Date
June 30, 1999
Publication Date
October 2, 2001
Inventor
Larry D Kinsman
Boise
ID, US
Leonard E Mess
Boise
ID, US
David J Corisis
Meridian
ID, US
Walter L Moden
Meridian
ID, US
Agent
TraskBritt
US
Assignee
Micron Technology
ID, US
IPC
H01L 23/02
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