06291313 is referenced by 88 patents and cites 205 patents.

A technique for forming a film of material (

12

) from a donor substrate (

10

). The technique has a step of forming a stressed region in a selected manner at a selected depth (

20

) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (

10

) at the selected depth (

20

), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Title
Method and device for controlled cleaving process
Application Number
9/313959
Publication Number
6291313 (B1)
Application Date
May 18, 1999
Publication Date
September 18, 2001
Inventor
Nathan Cheung
Albany
CA, US
Francois J Henley
Los Gatos
CA, US
Agent
Townsend and Townsend and Crew
US
Assignee
Silicon Genesis Corporation
CA, US
IPC
H01L 21/22
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