A technique for forming a film of material (
) from a donor substrate (
). The technique has a step of forming a stressed region in a selected manner at a selected depth (
) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (
) at the selected depth (
), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.