06286208 is referenced by 86 patents and cites 13 patents.

A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.

Title
Interconnector with contact pads having enhanced durability
Application Number
8/739343
Publication Number
6286208 (B1)
Application Date
October 28, 1996
Publication Date
September 11, 2001
Inventor
Maurice Norcott
Fishkill
NY, US
Brian Beaman
Hude Park
NY, US
Keith Edward Fogel
Mohegan Lake
NY, US
Paul Lauro
Nanuet
NY, US
Da Yuan Shih
Poughkeepsie
NY, US
Agent
Daniel P Morris
US
Thomas A Beck
US
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 43/02
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