06285204 is referenced by 66 patents and cites 16 patents.

A method for testing semiconductor packages using oxide penetrating test contacts is provided. The test contacts are attached to a burn-in board and include a base metal formed in compliant shape. In addition, the test contacts include a conductive layer having an abrasive grain material embedded therein. The conductive layer and abrasive grain material are adapted to penetrate an oxide coating on the package leads to form a low resistance electrical contact. The abrasive grain material can be formed of diamond, synthetic diamond, diamond like carbon or cubic boron nitride. The conductive layer and abrasive grain material can be formed on the base metal using a process such as electro-deposition, chemical deposition, powder metallurgy or vapor deposition.

Title
Method for testing semiconductor packages using oxide penetrating test contacts
Application Number
9/586463
Publication Number
6285204 (B1)
Application Date
June 3, 2000
Publication Date
September 4, 2001
Inventor
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
US
Assignee
Micron Technology
ID, US
IPC
G01R 1/073
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