06285075 is referenced by 222 patents and cites 8 patents.

An integrated circuit package includes a ceramic ring having an inside cavity for accommodating a semiconductor die. Conductive traces are provided on the ceramic ring so as to serve as power and ground signal busses. Power and ground connection pads on the semiconductor die can be commonly bonded to these conductive traces, which are in turn commonly bonded to selected pins of the lead frame. In addition, an acrylic adhesive is used as a moisture-resistant adhesive.

Title
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly
Application Number
9/184787
Publication Number
6285075 (B1)
Application Date
November 2, 1998
Publication Date
September 4, 2001
Inventor
Robert Sheppard
Redbluff
CA, US
Edward G Combs
Foster City
CA, US
Agent
Gallagher & Lathrop
US
Agent
Thomas A Gallagher
US
Assignee
ASAT
US
IPC
H01L 23/48
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