06274937 is referenced by 159 patents and cites 21 patents.

An apparatus is provided for the supply of passive electronic components to a chip containing circuitry capable of operating in a communications system. The invention provides a silicon interposer element chip package which includes a silicon substrate and which is capable of carrying one or more IC chips and which does not suffer semiconductor leeching problems. A silicon substrate is formed from a silicon layer and an insulating layer, preferably an oxide. The invention also provides passive circuits within the interposer element oxide layer. The interposer element is then bonded to an integrated circuit chip using flip-chip processing.

Title
Silicon multi-chip module packaging with integrated passive components and method of making
Application Number
9/241061
Publication Number
6274937 (B1)
Application Date
February 1, 1999
Publication Date
August 14, 2001
Inventor
Leonard Forbes
Corvallis
OR, US
Kie Y Ahn
Chappaqua
NY, US
Agent
Dickstein Shapiro Morin & Oshinsky
US
Assignee
Micron Technology
ID, US
IPC
H01L 23/48
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