06263941 is referenced by 59 patents and cites 183 patents.

A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.

Title
Nozzle for cleaving substrates
Application Number
9/370958
Publication Number
6263941 (B1)
Application Date
August 10, 1999
Publication Date
July 24, 2001
Inventor
James K Kai
San Francisco
CA, US
Michael A Bryan
Los Gatos
CA, US
Agent
Townsend and Townsend and Crew
US
Assignee
Silicon Genesis Corporation
CA, US
IPC
B32B 35/00
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