06258625 is referenced by 124 patents and cites 9 patents.

A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.

Title
Method of interconnecting electronic components using a plurality of conductive studs
Application Number
9/315374
Publication Number
6258625 (B1)
Application Date
May 18, 1999
Publication Date
July 10, 2001
Inventor
Kathleen A Stalter
Hopewell Junction
NY, US
Sudipta K Ray
Wappingers Falls
NY, US
Peter J Brofman
Hopewell Junction
NY, US
Agent
DeLio & Peterson
US
Agent
Ira D Blecker
US
Peter W Peterson
US
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/44
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