06258623 is referenced by 175 patents and cites 37 patents.

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with busses formed on one side. In another embodiment, the connector comprises multiple busses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with busses within the cage, or, alternatively, are directly fixed to leads or pads on the host circuit board.

Title
Low profile multi-IC chip package connector
Application Number
9/349522
Publication Number
6258623 (B1)
Application Date
July 8, 1999
Publication Date
July 10, 2001
Inventor
Jerry M Brooks
Caldwell
ID, US
Jerrold L King
Morgan Hill
CA, US
Walter L Moden
Meridian
ID, US
Agent
Trask Britt
US
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
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