06246108 is referenced by 148 patents and cites 10 patents.

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Title
Integrated circuit package including lead frame with electrically isolated alignment feature
Application Number
9/374176
Publication Number
6246108 (B1)
Application Date
August 12, 1999
Publication Date
June 12, 2001
Inventor
Jerrold L King
Morgan Hill
CA, US
Leland R Nevill
Boise
ID, US
Daniel Cram
Boise
ID, US
Michael Slaughter
Boise
ID, US
Tracy Reynolds
Boise
ID, US
David J Corisis
Meridian
ID, US
Agent
TraskBritt
US
Assignee
Micron Technology
ID, US
IPC
H01L 23/48
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