06242932 is referenced by 141 patents and cites 46 patents.

An interposer for electrically engaging semiconductor components having contact balls is provided. In a testing embodiment, the interposer configures a test socket for testing semiconductor components with different configurations of contact balls. In an assembly embodiment, the interposer can be used in the fabrication of an electronic assembly, to configure a substrate of the assembly for use with semiconductor components having different configurations of contact balls. The interposer includes a base having external contacts, an interconnect having contacts for electrically engaging the contact balls on the component, and an alignment member for aligning the component to the interconnect. The interconnect contacts can be made using semiconductor fabrication techniques for accommodating small, closely spaced contact balls on the components. In addition, conductors on the base and interconnect can have a “fan out” configuration, which permits contacts on the test socket, or substrate, to have a larger size and pitch than the contact balls on the component.

Title
Interposer for semiconductor components having contact balls
Application Number
9/253632
Publication Number
6242932 (B1)
Application Date
February 19, 1999
Publication Date
June 5, 2001
Inventor
David R Hembree
Boise
ID, US
Agent
Stephen A Gratton
US
Assignee
Micron Technology
ID, US
IPC
G01R 31/02
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