06242281 is referenced by 266 patents and cites 26 patents.

Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.

Title
Saw-singulated leadless plastic chip carrier
Application Number
9/363249
Publication Number
6242281 (B1)
Application Date
July 28, 1999
Publication Date
June 5, 2001
Inventor
Nelson Fan
Hong Kong
US
Neil Mclellan
Hong Kong
US
Agent
Gallacher & Lathrop
US
Agent
Thomas A Gallagher
US
Assignee
ASAT
US
IPC
H01L 21/44
View Original Source