06239495 is referenced by 86 patents and cites 7 patents.

A multichip semiconductor device comprises a plurality of semiconductor chips, each including elements integrated in a semiconductor substrate. The semiconductor chips have substantially the same structure. Each semiconductor chip includes a connecting plug inserted in a through hole made through the semiconductor substrate. The semiconductor chips are stacked in layers. The connecting plugs of the semiconductor chips are selectively connected through metal bumps. Allocation of addresses of the semiconductor chips is designated by a connecting pattern of the bumps.

Title
Multichip semiconductor device and memory card
Application Number
9/363031
Publication Number
6239495 (B1)
Application Date
July 29, 1999
Publication Date
May 29, 2001
Inventor
Katsuya Okumura
Yokohama
US
Nobuo Hayasaka
Yokosuka
US
Junichi Miyamoto
Yokohama
US
Koji Sakui
Tokyo
US
Agent
Banner & Witcoff
US
Assignee
Kabushiki Kaisha Toshiba
US
IPC
H01L 23/48
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