06219911 is referenced by 60 patents and cites 53 patents.

In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

Title
Flip chip mounting technique
Application Number
9/274748
Publication Number
6219911 (B1)
Application Date
March 23, 1999
Publication Date
April 24, 2001
Inventor
Toshihiro Mori
Moriyama
US
Masanori Akita
Otsu
US
Koji Ito
Otsu
US
Richard H Estes
Hollis
NH, US
Agent
Theresa A Lober
US
Assignee
Toray Engineering Co
US
Polymer Flip Chip
MA, US
IPC
H05K 3/34
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