06215670 is referenced by 159 patents and cites 215 patents.

An electronic assembly. The electronic assembly includes a first substrate which has a first set of contact pads and a second substrate which has a second set of contact pads. A plurality of elongate, springable interconnection elements are located between the first substrate and the second substrate. Each of the plurality of elongate, springable interconnect elements is free standing and has a portion permanently attached to a respective contact pad of the first set of contact pads and has a second portion contacting a respective contact pad of the second set of contact pads. The first and the second substrates are brought into a fixed relationship relative to one another.

Title
Method for manufacturing raised electrical contact pattern of controlled geometry
Application Number
9/245779
Publication Number
6215670 (B1)
Application Date
February 5, 1999
Publication Date
April 10, 2001
Inventor
Igor Y Khandros
Peekskil
NY, US
Agent
Blakely Sokoloff Taylor & Zafman
US
Assignee
FormFactor
CA, US
IPC
H05K 7/02
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