06214641 is referenced by 135 patents and cites 13 patents.

A lead-over-chip single-in-line memory module (LOC SIMM) and method of manufacturing is disclosed that provides for shortened wire bonds and ease of rework for unacceptable semiconductor dice. More specifically, the LOC SIMM of the present invention includes a plurality of slots extending through a circuit board with an equal number of semiconductor dice attached thereto such that the active surfaces of the dice are exposed through the slots. Wire bonds or TAB connections are made from the exposed active surface of the die, through the slot, and to contacts on the top surface of the circuit board. Dice proven unacceptable during burn-in and electrical testing of the module are replaced by known good dice (KGD) by breaking their respective wire bonds, attaching a KGD to the circuit board, and forming new electrical connections between the KGD and the circuit board.

Title
Method of fabricating a multi-chip module
Application Number
9/447983
Publication Number
6214641 (B1)
Application Date
November 23, 1999
Publication Date
April 10, 2001
Inventor
Salman Akram
Boise
ID, US
Agent
Trask Britt
US
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
View Original Source