06208521 is referenced by 207 patents and cites 22 patents.

A film carrier to be used for fabricating a new laminate type mounting structure, a new laminate type mounting structure comprising semiconductor elements mounted on the film carrier of the present invention and the laminate type mounting structure comprising a heat-releasing structure are provided. Due to the invention of the film carrier, handling of the semiconductor elements as well as fabrication of a laminate type mounting structure are facilitated. When a heat-releasing structure is added, the laminate type mounting structure of the present invention can advantageously efficiently release the heat generated by the semiconductor element in each layer.

Title
Film carrier and laminate type mounting structure using same
Application Number
9/80454
Publication Number
6208521 (B1)
Application Date
May 19, 1998
Publication Date
March 27, 2001
Inventor
Yasuo Nakatsuka
Ibaraki
US
Agent
Wenderoth Lind & Ponack L
US
Assignee
Nitto Denko Corporation
US
IPC
H05K 7/02
View Original Source