Film carrier and laminate type mounting structure using same United States Patent 06208521

06208521 is referenced by 207 patents and cites 22 patents.

A film carrier to be used for fabricating a new laminate type mounting structure, a new laminate type mounting structure comprising semiconductor elements mounted on the film carrier of the present invention and the laminate type mounting structure comprising a heat-releasing structure are provided. Due to the invention of the film carrier, handling of the semiconductor elements as well as fabrication of a laminate type mounting structure are facilitated. When a heat-releasing structure is added, the laminate type mounting structure of the present invention can advantageously efficiently release the heat generated by the semiconductor element in each layer.

Title
Film carrier and laminate type mounting structure using same
Application Number
9/80454
Publication Number
6208521 (B1)
Application Date
May 19, 1998
Publication Date
March 27, 2001
Inventor
Yasuo Nakatsuka
Ibaraki
US
Agent
Wenderoth Lind & Ponack L
US
Assignee
Nitto Denko Corporation
US
IPC
H05K 7/02
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Citations: 207 (view full list)

  1. Belgacem Haba Belgacem (Bel) Haba
    Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 6, 2008: US07368695 (23 worldwide citation)
  2. Hans Hermann Oppermann, Elke Zakel, Ghassem Azdasht, Paul Kasulke: Chips arranged in plurality of planes and electrically connected to one another. PAC Tech Packaging Technologies, Darby & Darby, August 28, 2001: US06281577 (184 worldwide citation)
  3. David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)
  4. Paul Goodwin: High capacity thin module system and method. Staktek Group, Fish & Richardson P C, January 29, 2008: US07324352 (84 worldwide citation)
  5. Ow Chee Moon, Eng Meow Koon: Flexible ball grid array chip scale packages. Micron Technology, TraskBritt, October 3, 2006: US07115986 (73 worldwide citation)
  6. Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle: Memory expansion and chip scale stacking system and method. Staktek Group, Andrews Kurth, July 5, 2005: US06914324 (73 worldwide citation)
  7. Teck Gyu Kang, Yoichi Kubota: Assemblies having stacked semiconductor chips and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 4, 2006: US07071547 (71 worldwide citation)
  8. Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Andrews Kurth, J Scott Denko, April 25, 2006: US07033861 (66 worldwide citation)
  9. James W Cady, Julian Partridge, James Douglas Wehrly Jr, James Wilder, David L Roper, Jeff Buchle: Low profile chip scale stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, April 11, 2006: US07026708 (64 worldwide citation)
  10. James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr: Integrated circuit stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, October 18, 2005: US06956284 (61 worldwide citation)

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