06194317 is referenced by 114 patents and cites 153 patents.

This invention pertains to a method of modifying or refining a surface of a wafer suited for semiconductor fabrication. This method may be used to modify a wafer having an unmodified, exposed surface comprised of a layer of a second material deployed over at least one discrete feature of a first material attached to the wafer. A first step of this method comprises contacting and relatively moving the exposed surface of the wafer with respect to an abrasive article, wherein the abrasive article comprises an exposed surface of a plurality of three-dimensional abrasive composites comprising a plurality of abrasive particles fixed and dispersed in a binder and maintaining contact to effect removal of the second material. In a second step, the contact and relative motion are continued until an exposed surface of the wafer has at least one area of exposed first material and at least one area of exposed second material.

Title
Method of planarizing the upper surface of a semiconductor wafer
Application Number
9/91932
Publication Number
6194317 (B1)
Application Date
June 24, 1998
Publication Date
February 27, 2001
Inventor
L Charles Hardy
St. Paul
MN, US
Thomas E Wood
Stillwater
MN, US
Heather K Kranz
Blaine
MN, US
David A Kaisaki
St. Paul
MN, US
Agent
Colene H Blank
US
Daniel R Pastirik
US
Assignee
3M Innovative Properties Company
MN, US
IPC
H01L 21/302
View Original Source