06188028 is referenced by 28 patents and cites 34 patents.

A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which is in electrical contact with a pair of contact pads on either surface of the circuit panel. One of the contact pads has an opening to allow access of a connecting post to the interior of the blind via, the other contact pad having a protruding post. The circuit panels are interconnected by inserting the post of one circuit panel into the blind via of an adjacent circuit panel.

Title
Multilayer structure with interlocking protrusions
Application Number
9/94089
Publication Number
6188028 (B1)
Application Date
June 9, 1998
Publication Date
February 13, 2001
Inventor
Masud Beroz
Milpitas
CA, US
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
US
Assignee
Tessera
CA, US
IPC
H01R 9/09
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