06184465 is referenced by 325 patents and cites 8 patents.

A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by electrical connections which extend from bond pads on the semiconductor die to corresponding bond pads on the substrate. An encapsulant is formed over each segment and contains grooves which correspond to the grooves of the substrate. Break points are thus formed at the grooves to permit the segments to be easily detached from the substrate to form individual integrated circuits.

Title
Semiconductor package
Application Number
9/191037
Publication Number
6184465 (B2)
Application Date
November 12, 1998
Publication Date
February 6, 2001
Inventor
David J Corisis
Meridian
ID, US
Agent
Dickstein Shapiro Morin & Oshinsky
US
Assignee
Micron Technology
ID, US
IPC
H01L 23/02
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