A probe card for testing semiconductor wafers, and a method for fabricating the probe card are provided. The probe card is adapted for use with a wafer probe handler, and a tester containing test circuitry. The probe card includes a substrate, and patterns of probe contacts formed on the substrate. Several different embodiments for the probe contacts are provided, including: etched projections covered with a conductive layer, microbumps formed on an electrically insulating polymer layer, indentations covered with conductive layers, and microbumps deposited in openings in an elastomeric mask layer. Some of the probe contacts are arranged in a four point Kelvin structure, adapted to measure a contact resistance between the probe contacts, and mating contacts on the wafer.