06176992 is referenced by 272 patents and cites 16 patents.

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.

Title
Method and apparatus for electro-chemical mechanical deposition
Application Number
9/201929
Publication Number
6176992 (B1)
Application Date
December 1, 1998
Publication Date
January 23, 2001
Inventor
Homayoun Talieh
San Jose
CA, US
Agent
Pillsbury Madison & Sutro
US
Assignee
Nutool
CA, US
IPC
C25D 5/00
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