06162663 is referenced by 18 patents and cites 27 patents.

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-.degree. C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Title
Dissipation of heat from a circuit board having bare silicon chips mounted thereon
Application Number
9/295081
Publication Number
6162663
Application Date
April 20, 1999
Publication Date
December 19, 2000
Inventor
Christine E Vogdes
1340 Nelson Way, Sunnyvale, 94087
CA, US
Robert H Reamey
2680 Ramona St., Palo Alto, 94301
CA, US
Benjamin L Sitler
1510 Miravalle Ave., Los Altos, 94024
CA, US
Paul G Schoenstein
1727 Kentucky St., Redwood City, 94061
CA, US
IPC
H01L 21/50
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