06154366 is referenced by 245 patents and cites 14 patents.

A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active surface includes at least one contact. A flex component is attached by a first surface to the microelectronic die active surface. At least one conductive trace is disposed on a second surface of the flex component and extends through the flex component to contact at least one of the contacts. An encapsulation material is adjacent the microelectronic die side and a bottom surface of the flex component. A moisture barrier is disposed on the flex component and the conductive trace(s). A second moisture barrier may be disposed on the encapsulation material. A heat dissipation device may also be incorporated into the chip-on-flex package.

Title
Structures and processes for fabricating moisture resistant chip-on-flex packages
Application Number
9/448066
Publication Number
6154366
Application Date
November 23, 1999
Publication Date
November 28, 2000
Inventor
Chuanbin Pan
San Jose
CA, US
Jian Li
Sunnyvale
CA, US
John Carruthers
Beaverton
OR, US
Harry Fujimoto
Sunnyvale
CA, US
Chun Mu
Saratoga
CA, US
Qing Ma
San Jose
CA, US
Agent
Robert G Winkle
Assignee
Intel Corporation
CA, US
IPC
H05K 7/20
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