06120366 is referenced by 34 patents and cites 10 patents.

The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source flow and vortex flow, and the streamline grooves of polishing pad uniformly distribute the slurry on the polishing pad. An angle and a depth of the streamline groove, which are calculated by boundary layer effect of the streamline groove function, are used to design an optimum structure for polishing pad.

Title
Chemical-mechanical polishing pad
Application Number
9/225367
Publication Number
6120366
Application Date
January 4, 1999
Publication Date
September 19, 2000
Inventor
Fu Yang Yu
Hsinchu
TW
Kun Lin Wu
Taichung
TW
Edward Yang
Kaohsiung
TW
Peng Yih Peng
Hsinchu Hsien
TW
Chien Hsin Lai
Kaohsiung Hsien
TW
Juen Kuen Lin
Kaohsiung
TW
Assignee
United Microelectronics
TW
IPC
B24B 1/00
B23F 21/03
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