06114240 is referenced by 273 patents and cites 36 patents.

A method for fabricating semiconductor components, such as packages, interconnects and test carriers, is provided. The method includes laser machining conductive vias for interconnecting contacts on the component, using a laser beam that is focused to produce a desired via geometry. The vias can include enlarged end portions to facilitate deposition of a conductive material during formation of the vias, and to provide an increased surface area for forming the contacts. For example, by focusing the laser beam at a midpoint of a substrate of the component, an hour glass via geometry is provided. Alternately, the laser beam can be focused at an exit point, or at an entry point of the substrate, to provide converging or diverging via geometries. The method can also include forming contact pins on the conductive vias by bonding and shaping metal wires using a wire bonding process, or a welding process.

Title
Method for fabricating semiconductor components using focused laser beam
Application Number
993965
Publication Number
6114240
Application Date
February 12, 1999
Publication Date
September 5, 2000
Inventor
Alan G Wood
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Salman Akram
Boise
ID, US
Agent
Stephen A Graton
Assignee
Micron Technology
ID, US
IPC
H01R 9/00
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