06103599 is referenced by 130 patents and cites 37 patents.

The present invention provides a multilayered wafer 10 such as an SOI wafer having a novel implanted layer. This implanted layer is removable and provides a resulting wafer having a substantially uniform surface. The wafer includes a bulk substrate 11 and an insulating layer 13 formed overlying the bulk substrate 15. A film of semiconductor material is formed overlying the insulating layer. Surface non-uniformities are formed overlying and in the film of semiconductor material. The non-uniformities are implanted, and are bordered by a substantially uniform interface 17 at a selected depth underlying the surface non-uniformities. The substantially uniform interface provides a substantially uniform resulting surface for the SOI wafer.

Title
Planarizing technique for multilayered substrates
Application Number
9/89931
Publication Number
6103599
Application Date
June 3, 1998
Publication Date
August 15, 2000
Inventor
Nathan Cheung
Albany
CA, US
Francois J Henley
Los Gatos
CA, US
Agent
Townsend and Townsend and Crew
Assignee
Silicon Genesis Corporation
CA, US
IPC
H01L 21/00
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