06097087 is referenced by 296 patents and cites 13 patents.

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.

Title
Semiconductor package including flex circuit, interconnects and dense array external contacts
Application Number
8/961881
Publication Number
6097087
Application Date
October 31, 1997
Publication Date
August 1, 2000
Inventor
Mike Brooks
Caldwell
ID, US
Alan G Wood
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 23/04
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