06080264 is referenced by 87 patents and cites 34 patents.

An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one semiconductor die with a face surface having both flip chip type electric connections and bond pads for wirebonding or TAB attachment thereof to at least one leadframe. Another aspect of the present invention comprises using two pair of back to back attached dice with leadframe lead fingers disposed between the dice pairs. The die face surfaces adjacent to the lead fingers are in direct electrical communication therewith via flip-chip type connectors. Bond pads on the die face surface facing outward from the lead fingers are electrically connected to the leadframe via wire bonds and/or TAB.

Title
Combination of semiconductor interconnect
Application Number
650157
Publication Number
6080264
Application Date
March 14, 1997
Publication Date
June 27, 2000
Inventor
Michael B Ball
Boise
ID, US
Agent
Trask Britt & Rossa
Assignee
Micron Technology
ID, US
IPC
H01K 3/05
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