06078500 is referenced by 94 patents and cites 9 patents.

A structure for packaging an electronic device. The package has: an electronic device having a first surface and an opposite second surface, the first surface having a plurality of first electrical contact locations; a substrate having a surface having a plurality of substrate electrical contact locations; a flexible interposer comprising a flexible material and a plurality of elongated electrical conductors disposed therein and extending from the first side to the second side, each of the elongated electrical conductors has a first end at the first side of the flexible interposer and a second end at the second side of the flexible interposer; the flexible interposer is disposed between the electronic device and the substrate; means for pushing the electronic device towards the substrate so that the flexible interposer is disposed between the first surface of the electronic device and the surface of the substrate so that the first ends of the elongated electrical conductors of the flexible interposer contact the first electrical contact locations at the first surface of the electronic device and so that the second ends of the elongated electrical conductors of the flexible interposer contact the substrate electrical contact locations; and, means for aligning the electronic device to the substrate so that the first and the second ends of the elongated electrical conductors of the flexible interposer align to the first electrical contact pads on the electronic device and to the substrate contact locations, respectively.

Title
Pluggable chip scale package
Application Number
9/76267
Publication Number
6078500
Application Date
May 12, 1998
Publication Date
June 20, 2000
Inventor
Da Yuan Shih
Poughkeepsie
NY, US
Paul Alfred Lauro
Nanuet
NY, US
Keith Edward Fogel
Mohegan Lake
NY, US
Brian Samuel Beaman
Apex
NC, US
Agent
Thomas A Beck
Assignee
International Business Machines
NY, US
IPC
H05K 7/20
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