06075284 is referenced by 159 patents and cites 11 patents.

Disclosed is a stack package. In the stack package, at least two semiconductor chips 40 are disposed up and down. Inner leads 31 of lead frames 30 are attached at a bonding pad-disposed face of the semiconductor chip 40. The inner leads 31 are electrically connected to the bonding pads of the semiconductor chips 40 with metal wires 50. Protruding portions 33,34 are formed at the inner leads 31 toward downside and upside. To expose the respective protruding portions 33,34 and outer leads 32 formed at the lowermost lead frame 30, the respective semiconductor chips 40 are molded with an epoxy compound 60. The respective lead frames 30 are electrically connected by contacting the upwardly or downwardly protruding portions 34, 33 from the respective lead frames.

Title
Stack package
Application Number
9/340543
Publication Number
6075284
Application Date
June 28, 1999
Publication Date
June 13, 2000
Inventor
Nam Soo Lee
Kyoungki-do
KR
Yoon Hwa Choi
Kyoungki-do
KR
Agent
Ladas & Parry
Assignee
Hyundai Electronics
KR
IPC
H01L 23/495
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