06069407 is referenced by 128 patents and cites 8 patents.

A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.

Title
BGA package using PCB and tape in a die-up configuration
Application Number
9/195349
Publication Number
6069407
Application Date
November 18, 1998
Publication Date
May 30, 2000
Inventor
Ahmad Hamzehdoost
Sacramento
CA, US
Agent
Patrick T King
Assignee
VLSI Technology
CA, US
IPC
H01L 23/52
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