06059579 is referenced by 7 patents and cites 13 patents.

An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.

Title
Semiconductor structure interconnector and assembly
Application Number
8/936240
Publication Number
6059579
Application Date
September 24, 1997
Publication Date
May 9, 2000
Inventor
James W Wilson
Vestal
NY, US
Robin A Susko
Owego
NY, US
Scott P Moore
Apalachin
NY, US
John S Kresge
Binghamton
NY, US
Agent
Heslin & Rothenberg P C
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/321
View Original Source