06048744 is referenced by 127 patents and cites 2 patents.

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Title
Integrated circuit package alignment feature
Application Number
8/929843
Publication Number
6048744
Application Date
September 15, 1997
Publication Date
April 11, 2000
Inventor
Jerrold L King
Morgan Hill
CA, US
Leland R Nevill
Boise
ID, US
Daniel Cram
Boise
ID, US
Michael Slaughter
Boise
ID, US
Tracy Reynolds
Boise
ID, US
David J Corisis
Meridian
ID, US
Agent
Trask Britt & Rossa
Assignee
Micron Technology
ID, US
IPC
H01L 21/50
H01L 21/48
H01L 21/44
H01L 21/66
G01R 31/26
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