06008070 is referenced by 185 patents and cites 18 patents.

A method for producing integrated circuit devices comprises the steps of forming and packaging such devices at the wafer scale, including forming a plurality of chip circuits with bond pads, adhesively fixing a plate of glass to the active surface of the wafer, slicing the wafer, applying a sealant layer to the backside of the wafer, forming contact holes through the upper glass plate, metallizing the glass plate and singulating the individual chips. Use of etchable glass for the package and palladium for metallization provides an advantageous construction method.

Title
Wafer level fabrication and assembly of chip scale packages
Application Number
9/82745
Publication Number
6008070
Application Date
May 21, 1998
Publication Date
December 28, 1999
Inventor
Warren M Farnworth
Nampa
ID, US
Agent
Trask Britt & Rossa
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
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